School of Physics - Universiti Sains Malaysia

Thermal Management Research Laboratory

 

OVERVIEW

TMRL was established during 2010 to conduct the research on improving the performance of optoelectronic devices like LED (for Solid State Lighting, SSL) and its research has been focused on advanced material and packaging technologies including thermal management by adopting an innovative and internationally recognized thermal management methodology (ASTM-compliant). TMRL is the first of its kind in Malaysia which specializes in thermal, optical and material analysis that supports leading semiconductor companies like Western Digital, Intel, Osram, LumiLEDs, Pentamaster, QDOS etc. We are currently working on simulation, testing and reliability studies to solve the thermal related issues in SSL and electronic packaging products by utilizing leading industrial softwares (FloTHERM, FloEFD, TracePro, TeraLED, COMSOL etc) and equipments (T3ster, TC- TPS2500 etc.).

 

1. Teraled System 

DSC00632
2. Thermal Test Frame  DSC00633
3. Thermal Imaging Camera DSC00634
4. Carbolyte 3 Zone Furnace System DSC00635
5. TPS Hot Disc Method DSC00639
6. Spin Coater DSC00641
7. Vacuum Oven DSC00644

COLLABORATION

1. Western Digital, Penang

2. Intel, Kulim

3. Osram, Penang

4. Pentamaster Sdn. Bhd., Penang

5. Regensburg University, Germany

6. Millennium Substrates Sdn Bhd, Penang

7. USAINS Infotech, Penang

8. QAV Technolgy Sdn. Bhd., Penang

9. QDOS Flexcircuits Sdn. Bhd., Penang

10. CREST, Penang

CONSULTATION

INDUSTRIES

1. Western Digital, Penang. 

2. QAV Technologies Sdn.Bhd., Penang 

3. Millennium Substrates Sdn Bhd.,Penang 

4. QDOS Flexcircuits Sdn Bhd., Penang 

5. ItraMAS, Penang 

6. Pentamaster Sdn Bhd., Penang

INSTITUTION

1. University of Malaya

2. UTM

3. UiTM

4. UTAR

5. USIM

6. UniMAP

7. School of Engineering, USM


SERVICES

 

      


Equipment Analysis

Description Rate (RM)*
1 T3Ster - Thermal transient analyzer with pneumatic TIM  test frame To measure the thermal resistance and impedance of the electronic packages at various pressure 150 - 400
2 TeraLED radiometric charactization To measure the thermal and optical performance of Solid State Lighting  devices 200 - 400
3 Thermal conductivity analyzer To measure the thermal conductivity of solid and liquid samples  100 - 350
4 Thermal imaging IR camera  To monitor or observe the thermal profile of the LED 100 - 200
*Depends on the testing condition and customer  

OTHER EQUIPMENT

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The Dean, School of Physics,
Universiti Sains Malaysia,
11800 USM,
Penang, Malaysia

Tel : 604 653 3200  |  Fax: 604 657 9150  |   Email :  This email address is being protected from spambots. You need JavaScript enabled to view it. |